Besi is responsible for the development of new bonding equipment capabilities and processes to support system integration in ARCTIC.

Besi Austria GmbH forms part of the larger Dutch group BE Semiconductor Industries, N.V., an international group of companies operating in the assembly and packaging sector of the semiconductor industry. BESI’s main area of expertise is the development of leading-edge high-precision and high-flexibility assembly processes and die-handling equipment for flip-chip and multi-chip substrate and wafer-level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud server, computing, automotive, industrial, LED and solar energy, with over 25 years’ experience.

Within ARCTIC, Besi will leverage the consortium’s novel materials for cryogenic and quantum devices to develop new prototype bonding equipment and processes, especially thermocompression at a broad range of temperatures. This includes the implementation of several critical measures, for example, improving the large die handling capabilities, inert atmosphere, increasing accuracy, or establishing high levels of cleanliness. Besi will also expand its pre- and post-bond qualification technology to implement (in-line) process control.

On top of this technical work, Besi is coordinating the work within work package WP 5 and specifically Task 5.1, as well as Demonstrator T7.T.

More information on https://www.besi.com